Michael W. Degner

基本信息

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职业迁徙

个人简介

He was granted more than 165 U.S. patents and has published more than 60 conference and refereed journal articles.,Dr. Degner was the recipient of several IEEE Industry Applications Society Transactions and Conference paper awards.

研究兴趣

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Capillary-Based Two-Phase Cooling for High Power Density Power Electronics

Yujui Lin,Heungdong Kwon, Yini He, Hao Chen,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,H. Alan Mantooth,Kenneth E. Goodson

ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2024)

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The Impact of Liquid Supply Delivery Methods on the Thermal Performance of a Capillary-based Two-phase Micro-cooler for the Power Electronics

Yujui Lin,Heungdong Kwon,Hao Chen,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,H. Alan Mantooth,Kenneth E. Goodson

2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-8, (2024)

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Development of a Hybrid Capillary-driven Single-phase and Two-phase Micro-cooler for Power Electronics Cooling

Yujui Lin,Heungdong Kwon,Hao Chen,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,H. Alan Mantooth,Kenneth E. Goodson

IEEE Transactions on Components Packaging and Manufacturing Technologyno. 5 (2024): 810-823

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Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Yujui Lin,Tiwei Wei, Wyatt Jason Moy,Hao Chen,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,H. Alan Mantooth,Kenneth E. Goodson

JOURNAL OF ELECTRONIC PACKAGINGno. 1 (2024)

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Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

Yujui Lin,Tiwei Wei, Wyatt Jason Moy,Hao Chen,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,H. Alan Mantooth,Kenneth E. Goodson

Journal of Electronic Packagingno. 2 (2023)

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Numerical Study of Large Footprint (24 × 24 Mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei,Sougata Hazra,Yujui Lin,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,Kenneth E. Goodson

JOURNAL OF ELECTRONIC PACKAGINGno. 2 (2023)

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Transactive Energy for EV Owners and Aggregators: Mechanism and Algorithms

Chensen Qi,Chen-Ching Liu,Xi Lu, Lan Yu,Michael W. Degner

IEEE Transactions on Sustainable Energy（2023）

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Design Optimization and Performance Pareto Front Development of a Multi-Level 3d Manifolded Extreme Heat Flux Cooler Via Reduced Order Numerical Modeling

Sougata Hazra,Tiwei Wei,Yujui Lin,Mehdi Asheghi,Kenneth Goodson,Man Prakash Gupta,Michael Degner

SSRN Electronic Journal（2022）

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Investigation of Surge Voltage Propagation in Inverter-Driven Electric Machine Windings

Yanyan Xie,Julia Zhang,Franco Leonardi,Alfredo R. Munoz,Michael W. Degner

IEEE Transactions on Industrial Electronicsno. 10 (2022): 9811-9822

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Guest Editorial Special Issue on Electric Machine Drives and Converters for Automotive Applications

Gianmario Pellegrino,Michael Degner

IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS（2022）

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