Michael W. Degner

基本信息

Career Trajectory

Bio

He was granted more than 165 U.S. patents and has published more than 60 conference and refereed journal articles.,Dr. Degner was the recipient of several IEEE Industry Applications Society Transactions and Conference paper awards.

Research Interests

Papers共 186 篇Author StatisticsCo-AuthorSimilar Experts

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The Impact of Liquid Supply Delivery Methods on the Thermal Performance of a Capillary-based Two-phase Micro-cooler for the Power Electronics

Yujui Lin,Heungdong Kwon,Hao Chen,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,H. Alan Mantooth,Kenneth E. Goodson

2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-8, (2024)

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Development of a Hybrid Capillary-driven Single-phase and Two-phase Micro-cooler for Power Electronics Cooling

Yujui Lin,Heungdong Kwon,Hao Chen,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,H. Alan Mantooth,Kenneth E. Goodson

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 5 (2024): 810-823

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Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Yujui Lin,Tiwei Wei, Wyatt Jason Moy,Hao Chen,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,H. Alan Mantooth,Kenneth E. Goodson

JOURNAL OF ELECTRONIC PACKAGINGno. 1 (2024)

Cited1Views0Bibtex

Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module

Yujui Lin,Tiwei Wei, Wyatt Jason Moy,Hao Chen,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,Alan Mantooth,Kenneth Goodson

Journal of Electronic Packagingpp.1-45, (2023)

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Transactive Energy for EV Owners and Aggregators: Mechanism and Algorithms

Chensen Qi,Chen-Ching Liu,Xi Lu, Lan Yu,Michael W. Degner

IEEE Transactions on Sustainable Energy（2023）

Cited1Views0EIWOSBibtex

Investigation of Surge Voltage Propagation in Inverter-Driven Electric Machine Windings

Yanyan Xie,Julia Zhang,Franco Leonardi,Alfredo R. Munoz,Michael W. Degner

IEEE Transactions on Industrial Electronicsno. 10 (2023): 9811-9822

Cited2Views0EIWOSBibtex

Numerical Study of Large Footprint (24 × 24mm2) Silicon-Based Embedded Microchannel 3D Manifold Coolers

Tiwei Wei,Sougata Hazra,Yujui Lin,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,E. Kenneth Goodson

Journal of Electronic Packaging (2022)

Cited1Views0Bibtex

Numerical Study of Large Footprint (24 × 24 Mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei,Sougata Hazra,Yujui Lin,Man Prakash Gupta,Michael Degner,Mehdi Asheghi,Kenneth E. Goodson

Journal of electronic packagingno. 2 (2022)

Cited0Views0Bibtex

Design Optimization and Performance Pareto Front Development of a Multi-Level 3d Manifolded Extreme Heat Flux Cooler Via Reduced Order Numerical Modeling

Sougata Hazra,Tiwei Wei,Yujui Lin,Mehdi Asheghi,Kenneth Goodson,Man Prakash Gupta,Michael Degner

SSRN Electronic Journal（2022）

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Guest Editorial Special Issue on Electric Machine Drives and Converters for Automotive Applications

Gianmario Pellegrino,Michael Degner

IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS（2022）

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Papers共 186 篇Author StatisticsCo-AuthorSimilar Experts