基本信息
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职业迁徙
个人简介
I am a mechanical engineer pursuing a PhD under Dr. David Huitink. I have extensive knowledge of fixturing and tooling, thermomechanical simulation, and electronics package design. My current research is focused on enabling transient liquid phase die attachment for extreme environments in the manufacturing space.
研究兴趣
论文共 8 篇作者统计合作学者相似作者
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PROCEEDINGS OF ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2023 (2023)
Journal of materials science Materials in electronicsno. 10 (2023)
JOURNAL OF APPLIED PHYSICSno. 14 (2023)
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systemspp.1-4, (2022)
2021 THIRTY-SIXTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2021)pp.2313-2317, (2021)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. HiTEC (2021): 000058-000063
2021 IEEE 12th International Symposium on Power Electronics for Distributed Generation Systems (PEDG)pp.1-6, (2021)
作者统计
#Papers: 8
#Citation: 13
H-Index: 3
G-Index: 3
Sociability: 3
Diversity: 0
Activity: 2
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