基本信息
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职业迁徙
个人简介
Hengying Shan received the B.S. degree in electronics engineering from the Harbin Institute of Technology, China, in 2009 and the M.S. degree in IC design engineering from the Hong Kong University of Science and Technology (HKUST) in 2010. From 2011 to 2013, she was a Project Intern then a Research Assistant with Hong Kong Applied Science and Technology Institution and HKUST, respectively.
She is currently pursuing the Ph.D. degree in electrical and computer engineering with Purdue University. Her research interests include mixed signal circuit design and RF front end design.
研究兴趣
论文共 13 篇作者统计合作学者相似作者
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2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G)pp.1-4, (2019)
2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G)pp.1-3, (2019)
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作者统计
#Papers: 13
#Citation: 113
H-Index: 6
G-Index: 10
Sociability: 3
Diversity: 2
Activity: 1
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