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论文共 49 篇作者统计合作学者相似作者

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The Effectiveness of Ni Microalloying on the Microstructure and Mechanical Properties of Low Temperature In-35 Wt%Sn/Cu Solder Joint
M. S. Chang,M. A. A. Mohd Salleh,F. Somidin, D. S. C. Halin, H. Yasuda,K. Nogita
Materials science and engineering A, Structural materials proporties, microstructures and processing/Materials science & engineering A, Structural materials properties, microstructure and processing (2023): 145457-145457
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A Short Review: Reliability Issues of Lead-Free Sn-Based Alloys for Superconducting Applications
Y. P. Tan,Flora Somidin
Springer proceedings in physicspp.63-71, (2023)
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Contribution of Ni Microalloying to Cu Dissolution in In–35Sn/Cu Solder Joints after Multiple Reflows
M. S. Chang,M. A. A. Mohd Salleh,D. S. C. Halin,F. Somidin, H. Yasuda,K. Nogita
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2023): 8670-8687
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Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics
Flora Somidin,Rita Mohd Said,Norainiza Saud,Mohd Arif Anuar Mohd Salleh
Recent Progress in Lead-Free Solder TechnologyTopics in Mining, Metallurgy and Materials Engineeringpp.95-112, (2022)
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Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Ball Grid Array and Sn-10Cu Solder Paste
Rita Mohd Said, Kalaiarasi AP Sulwarajan,Nurul Razliana Abdul Razak,Flora Somidin, Nur Syahirah Muhammad Zaimi
Journal of physics Conference seriesno. 1 (2022): 012010-012010
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作者统计

#Papers: 49

#Citation: 317

H-Index: 9

G-Index: 17

Sociability: 4

Diversity: 2

Activity: 11

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