The Effectiveness of Ni Microalloying on the Microstructure and Mechanical Properties of Low Temperature In-35 Wt%Sn/Cu Solder Joint

M. S. Chang,M. A. A. Mohd Salleh,F. Somidin, D. S. C. Halin, H. Yasuda,K. Nogita

Materials science and engineering A, Structural materials proporties, microstructures and processing/Materials science & engineering A, Structural materials properties, microstructure and processing（2023）

引用 1|浏览18

暂无评分

关键词

Interfacial intermetallic,Solute undercooling,In-situ synchrotron imaging,Solidification,Shear strength

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要