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论文共 11 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
Emuobosan Enakerakpo,Ashraf Umar,Mohammed Alhendi,Riadh Al-Haidari,Dylan J. Richmond,Udara Sandakelum Somarathna,Stephen Gonya,Mark D. Poliks,Tom Rovere, Matthew Beckford, Jonathan Nichols
IEEE JOURNAL OF RADIO FREQUENCY IDENTIFICATION (2024): 49-57
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2213-2217, (2023)
IEEE transactions on components, packaging, and manufacturing technologyno. 2 (2023): 171-176
Jarrid A. Wittkopf, Sanil Jhaveri, Fan Fei, Manjarik Mrinal, Eric Luna-Ramirez,Dylan Richmond,Dayue Jiang,Fuda Ning, Mohamed Alhendi, Detlef Smilgies,Mark D. Poliks,Lihua Zhao
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1463-1470, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.668-675, (2023)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1927-1933, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.2298-2304, (2022)
Dylan Richmond,Mason McCormick,Thilini K. Ekanayaka,Jacob D. Teeter, Benjamin L. Swanson,Nicole Benker,Guanhua Hao, Sharmin Sikich,Axel Enders,Alexander Sinitskii,Carolina C. Ilie,Peter A. Dowben,Andrew J. Yost
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作者统计
#Papers: 11
#Citation: 7
H-Index: 2
G-Index: 2
Sociability: 4
Diversity: 1
Activity: 1
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