按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
EIWOS
0
0
IEEE TRANSACTIONS ON NUCLEAR SCIENCEno. 4 (2024): 809-815
EIWOS
0
0
2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)pp.13-15, (2023)
EIWOS
0
0
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.668-675, (2023)
EIWOS
0
0
Materials science forum (2022): 422-426
0
0
Materials science forum (2022): 477-481
1
0
ECS Transactionsno. 7 (2021): 67-73
2
0
Diamond and related materials (2020)
0
0
加载更多