基本信息
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职业迁徙
个人简介
Xiangbin Du received the M.S. degree in biomedical-engineering from the Taiyuan University of Technology (TYUT), Taiyuan, China, in 2020.
He is currently working with the Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China. His research interests include microsystems integration technology.
研究兴趣
论文共 28 篇作者统计合作学者相似作者
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期刊级别
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合作机构
ENGINEERING (2024): 201-208
Lihang Yu,Yuxin Ye,Zhenyu Wang,Ruiwen Liu,Xiangbin Du,Yanmei Kong,Shichang Yun, Jie Wang, Yulin Shi,Binbin Jiao
THERMAL SCIENCEno. 2 (2024): 877-888
Applied thermal engineering (2024): 122953-122953
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 1 (2024): 502-509
Jingping Qiao, Jingyu Chen,Binbin Jiao,Ruiwen Liu,Yanmei Kong,Yuxin Ye,Lihang Yu,Xiangbin Du,Shichang Yun, Qixing Hao,Dichen Lu,Ziyu Liu
IEEE sensors journalno. 2 (2024): 1245-1254
Yuxin Ye,Xiangbin Du,Yanmei Kong,Ruiwen Liu,Shichang Yun,Shiqi Jia, Wei Li,Xiaorui Lv,Pengrong Lin, Zhiqiang Wang,Binbin Jiao
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.1017-1021, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.606-611, (2023)
NEMSpp.209-212, (2023)
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作者统计
#Papers: 28
#Citation: 229
H-Index: 6
G-Index: 12
Sociability: 4
Diversity: 2
Activity: 35
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