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Engineering (2024)
Lihang Yu,Binbin Jiao,Yuxin Ye,Xiangbin Du,Yanmei Kong,Ruiwen Liu, Jingping Qiao,Shichang Yun, Zhiqiang Wang, Wei Li, Yingzhan Yan, Dichen Lu,
Applied Thermal Engineeringpp.122953, (2024)
Dichen Lu,Yuxin Ye,Ruiwen Liu,Mei Wu,Xiangbin Du,Lihang Yu, Jingping Qiao,Ziyu Liu,Yanmei Kong,Binbin Jiao,Xiaohua Ma,Yue Hao
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 1 (2024): 502-509
Jingping Qiao, Jingyu Chen,Binbin Jiao,Ruiwen Liu,Yanmei Kong,Yuxin Ye,Lihang Yu,Xiangbin Du,Shichang Yun, Qixing Hao, Dichen Lu,Ziyu Liu
IEEE SENSORS JOURNALno. 2 (2024): 1245-1254
Biomimetics (Basel, Switzerland)no. 2 (2023): 207-207
Yuxin Ye,Xiangbin Du,Yanmei Kong,Ruiwen Liu,Shichang Yun,Shiqi Jia, Wei Li,Xiaorui Lv,Pengrong Lin, Zhiqiang Wang,Binbin Jiao
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.1017-1021, (2023)
Lihang Yu,Yuxin Ye,Zhenyu Wang,Ruiwen Liu,Xiangbin Du,Yanmei Kong,Shichang Yun, Jie Wang, Yuling Shi,Binbin Jiao
Thermal Sciencepp.174-174, (2023)
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2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI)pp.204-208, (2023)
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Jingping Qiao,Binbin Jiao,Shiqi Jia,Ruiwen Liu,Shichang Yun,Yanmei Kong,Yuxin Ye,Xiangbin Du,Lihang Yu, Dichen Lu,Ziyu Liu,Jie Wang
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.606-611, (2023)
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