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职业迁徙
个人简介
David Soon Wee Ho received the B.Eng. degree from the Department of Material Science, Nanyang Technology University, Singapore, in 2005.
He is currently a Principal Research Engineer with the Heterogeneous Integration (HI) Department, Institute of Microelectronics, A*STAR, Singapore. His current research interests include wafer fabrication in the area of embedded wafer-level package, TSV, and TSI devices.
研究兴趣
论文共 50 篇作者统计合作学者相似作者
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Sajay Bhuvanendran Nair Gourikutty,Jiaqi Wu,Teck Guan Lim, San Sandra,Ming Chinq Jong,Chia Lai Yee,Lau Boon Long,David Soon Wee Ho,Chong Ser Choong, Ding Liang, Xiaoguang Tu, Wanjun Wang, Chee-Keong Tan, Alison See, Hsiu-Che Wang,Roberto Coccioli,Ronson Tan,Radhakrishnan Nagarajan,Surya Bhattacharya
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1398-1403, (2024)
Chai Tai Chong,Lau Boon Long,Sharon Lim Pei Siang,David Ho Soon Wee,Rob van Kampen,Paul Castillou,Roberto Gaddi, Lance Barron,Mickael Renault, Jay Ko, Jonathan Hammond
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.24-28, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.207-211, (2023)
Dominica Giusti,Alex Gritti,Fabio Quaglia,Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino,Dutta Rahul,Vempati Srinivasa Rao,David Ho Soon Wee, Masatoshi Wakahara,Mark Shaw
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1442-1449, (2023)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.125-128, (2023)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.89-93, (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.280-285, (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.01-06, (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
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作者统计
#Papers: 50
#Citation: 556
H-Index: 12
G-Index: 22
Sociability: 5
Diversity: 1
Activity: 1
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