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论文共 169 篇作者统计合作学者相似作者

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Analysis of Differential Stripline Routing Approaches Within a PCB Via Field for Crosstalk Mitigation
Srijan Datta, Yuechen Wang,Junyan Tang,Xianbo Yang,Yanyan Zhang,Pavel R. Paladhi,Mahesh Bohra,Joshua C. Myers,Sungjun Chun,Daniel M. Dreps
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (2023)
引用0浏览0EIWOS引用
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Analyses of Via-In-Pad Plated Over (VIPPO) and Dogbone in Fanout Routing High-Density Interconnects
Yanyan Zhang,Junyan Tang,Xiaomin Duan, Srijan Dana,Pavel R. Paladhi,Mahesh Bohra,Sungjun Chun,Daniel M. Dreps
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2023)
引用0浏览0EIWOS引用
0
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Broadside-Coupled Differential Routing In Package Via Pin-Field Design
Yanyan Zhang,Lloyd Walls,Mahesh Bohra,Junyan Tang,Xianbo Yang,Wiren D. Becker,Daniel M. Dreps
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2021)
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0
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A 25×50Gb/s 2.22pJ/b NRZ RX with Dual-Bank and 3-Tap Speculative DFE for Microprocessor Application in 7nm FinFET CMOS
Yang You,Glen Wiedemeier,Chad Marquart,Chris Steffen, Erik English,Dereje Yilma, Thomas Pham,Venkat Nammi, Jeffrey Okyere, Nathan Blanchard,Akil Sutton, Ze Zhang, David Friend, Diego Barba, Tyler Bohlke, Michael Spear, Vikram Raj, James Crugnale,Daniel Dreps,Pier Andrea Francese,Marcel Kossel,Thomas Morf
2020 IEEE Symposium on VLSI Circuitspp.1-2, (2020)
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作者统计

#Papers: 171

#Citation: 3804

H-Index: 32

G-Index: 43

Sociability: 6

Diversity: 1

Activity: 3

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