SI Model to Hardware Correlation on a 44 Gb/s HLGA Socket Connector
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)（2020）
关键词
SI model,HLGA socket connector,comprehensive signal integrity model,hardware correlation,hybrid land grid array socket connector design,design SI performance,3D electromagnetic modelling,connector hardware evaluation,systematic testing,3D EM modelling,signal integrity
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