Atsushi Kubo

Atsushi Kubo received the bachelor’s and master’s degrees in applied chemistry from the Shibaura Institute of Technology, Tokyo, Japan, in 2000 and 2002, respectively. He joined Tokyo Ohka Kogyo Company, Ltd., Kanagawa-Ken, Japan, in 2002 and started to work with the Advanced Material Development Division for next-generation materials research and development for semiconductor packaging. He has been with the 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA, as a Visiting Engineer since 2015. He is affiliated with the Engineering Service Department, Tokyo Ohka Kogyo America, Inc., Hillsboro, OR, USA. His current research interests include the characterization of novel photosensitive dielectric materials and creating new applications for these dielectrics.