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First Demonstration of Silicon-Like >250 I/O Per mm Per Layer Multilayer RDL on Glass Panel Interposers by Embedded Photo-Trench and Fly Cut Planarization

Bartlet DeProspo,Fuhan Liu,Chandrasekharan Nair,Atsushi Kubo,Frank Wei,Ye Chen,Venkatesh Sundaram,Rao Tummala

Electronic Components and Technology Conference（2018）

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关键词
Glass Interposers,Fly-Cut Planarizaton,Embedded Trench Process
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