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个人简介
Tianming Ni (Member, IEEE) received the B.S. degree in integrated circuit design and integrated systems from the Tianjin University of Tech-nology, Tianjin, China, in 2013, and the Ph.D. degree in integrated circuits and systems from Hefei University of Technology, Hefei, China, in 2018.
His research interest includes built-in-self-test, design automation of digital systems, design for IC reliability, three-dimensional IC test and fault tolerance.
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Aibin Yan, Zhixing Li, Zhongyu Gao,Jing Zhang,Zhengfeng Huang,Tianming Ni,Jie Cui,Xiaolei Wang,Patrick Girard,Xiaoqing Wen
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systemsno. 99 (2024): 1-1
ACM Transactions on Design Automation of Electronic Systemsno. 1 (2024): 1:1-1:3
Journal of Electronic Testingpp.1-12, (2024)
2023 IEEE 32nd Asian Test Symposium (ATS)pp.55-59, (2023)
IEEE Transactions on Circuits and Systems Ii-express Briefsno. 99 (2023): 1-1
2023 ASIAN HARDWARE ORIENTED SECURITY AND TRUST SYMPOSIUM, ASIANHOSTpp.1-6, (2023)
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