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个人简介
working on energy-efficient data converter, power/signal integrity, and 3-D integration technologies, where he is currently the Program Manager in 3-D program addressing system scaling using advanced 3-D through-silicon via (TSV) and packaging fan-out wafer-level packaging (FO-WLP) technology for high-performance, mobile, and the Internet of Things applications. His research interests include characterization, modeling, system exploration, and design enablement of 3-D integration technologies.
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2023): 1567-1575
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Mohamed Naeim,Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser,Giuliano Sisto,Moritz Brunion,Rongmei Chen,Geert Van der Plas,Eric Beyne,Dragomir Milojevic
2023 IEEE International 3D Systems Integration Conference (3DIC)pp.1-4, (2023)
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IRPSpp.1-7, (2023)
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2023 45TH ANNUAL EOS/ESD SYMPOSIUM, EOS/ESD (2023): 1-7
2023 45TH ANNUAL EOS/ESD SYMPOSIUM, EOS/ESD (2023): 1-9
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.537-541, (2023)
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2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.1108-1113, (2022)
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