Numerical Investigation on the Thermal Resistance and Assembly Cost in SSC and DSC Power Modules
2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)（2024）
关键词
Thermal Resistance,Assembly Cost,Layer Thickness,Finite Element Method,Device Resistance,Dielectric Breakdown,Finite Element Method Simulations,Copper Layer,Partial Discharge,Ceramic Layer,Printed Circuit Board,Thick Copper,Power MOSFETs,Heat Spreader
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要