Editorial: Emerging Chip Materials and Devices for Post Moore’s Era
Frontiers in Materials（2023）
关键词
layered semiconductors,lateral epitaxial heterojunctions,integrated biochips,3D integration,sensor,interconnect materials
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要