Direct Contact Electroplating Sequence Without Initial Seed Layer for Bifacial TOPCon Solar Cell Metallization

Benjamin Gruebel,Gisela Cimiotti,Christian Schmiga,Varun Arya,Bernd Steinhauser,Norbert Bay,Michael Passig,Damian Brunner,Markus Glatthaar,Sven Kluska

IEEE journal of photovoltaics（2021）

引用 9|浏览12

暂无评分

关键词

Photovoltaic cells,Plating,Metals,Voltage measurement,Electrolytes,Conductivity,Surface emitting lasers,Forward bias plating (FBP),light induced plating (LIP),passivating contacts,silicon solar cells,tunneling oxide and passivating contacts (TOPCon)

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要