BEoL Layout Design Considerations to Mitigate CPI Risk

Mohamed A. Rabie,Thiagarajan Raman,Fahad Mirza,Nicholas A. Polomoff,Danish Faruqui,Scott Pozder,Md Khaled Hassan, Tamer Desouky,Carole Graas

International Interconnect Technology Conference（2018）

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关键词

BEoL layout design considerations,flip-chip configuration,metal tiles,metal stack,diagonal final aluminum cap metal lines,corner bumps,CPI risk mitigation,main back end of line design optimization techniques,chip package interaction risk,PSPI angle opening,double rail crackstops

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