Reliability study for large silicon interposers report on board
Electronic Components and Technology Conference（2013）
关键词
chip scale packaging,copper,elemental semiconductors,failure analysis,finite element analysis,fracture,interconnections,passivation,polymers,semiconductor device metallisation,semiconductor device reliability,semiconductor device testing,silicon,wafer level packaging,2.5d silicon interposers,3d silicon interposers,alx passivation,dt performances,jedec recommendations,pcsb,si,tcob,wlcsp,weibull plot lifetime statistics,ball layout,ball location,bump metallization levels,die thickness,digital applications,double polymer passivation,drop test performances,finite element modelling,fracture mode analyses,heterogeneous rf 3d modules,interposer packages,mobile applications,passivation layers,reliability tests,skipping balls,standard sac balls,temperature -40 degc,temperature 125 degc,thermal cycles,thermal cycles on board,wafer level chip scale package,reliability,stress
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