Thermo-compression Bonding Assembly Process and Reliability Studies of Cu Pillar Bump on Cu/Low-K Chip
Electronics Packaging Technology Conference（2014）
关键词
assembling,copper,lead bonding,low-k dielectric thin films,reliability,tape automated bonding,C4 reflow,CPI effect,Cu,GLOBALFOUNDRIES technology node,TCB-NCP processes,advanced node silicon devices,capillary underfill process,chip-package-interaction effect,cold joints,electrical performance,low k stress,low-k chip,package BOM selection,pillar bump,pitch joints,reliability studies,size 28 nm,thermocompression bonding assembly process,thermomechanical stress,ultra low-k dielectrics
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