Bjoern Boehme - Elect Packaging Lab, Tech Univ Dresden

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论文共 24 篇作者统计合作学者相似作者

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Wafer Level Chip Scale Package Failure Mode Prediction Using Finite Element Modeling

Viktor Dudash,Kashi Vishwanath Machani,Bjoern Boehme,Simone Capecchi, Jungtae Ok,Karsten Meier,Frank Kuechenmeister,Marcel Wieland,Karlheinz Bock

2023 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS (2023)

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Package Qualification Envelope for 22FDX® Technology

Christian Klewer,Frank Kuechenmeister,Jens Paul,Dirk Breuer,Bjoern Boehme,Jae Kyu Cho,Simone Capecchi,Michael Thiele

Proceedings of the International Symposium on Microelectronicsno. 1 (2019): 000169-000175

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Chip Package Interaction with Cu Pillar Interconnects - Impact of Die Warpage

Bjoem Boehme, Maricel Sy,Simone Capecchi,Dirk Breuer, Ta-Chien Cheng,Christian Goetze,Frank Kuechenmeister,Bjoern Boehme, Markel Sy

European Microelectronics Packaging Conference（2019）

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Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (beol) Silicon, Cu Pillar Design and Applied Process Improvements

Frank Kuechenmeister,Dirk Breuer,Holm Geisler,Bjoern Boehme,Kashi Vishwanath Machani,Michael Hecker, Sven Kosgalwies,Jae Kyu Cho,Dongming He, Xuefeng Zhang,Lily Zhao

Proceedings of the International Symposium on Microelectronicsno. 1 (2018): 000173-000179

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A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low K Dielectric Materials in Back End of Line

Frank Kuechenmeister,Dirk Breuer,Holm Geisler,Christian Klewer,Bjoern Boehme,Kashi Vishwanath Machani,Michael Hecker,Christian Goetze,Jae Kyu Cho,Himani Kamineni,Jens Paul,Michael Thiele

Proceedings of the International Symposium on Microelectronicsno. 1 (2017): 000163-000171

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Chip package interaction with Cu Pillar interconnects - systematic study of key factors impacting the qualification

Bjoern Boehme,Dirk Breuer,Christian Goetze, Al Rhea Estoque, Falk Tischer,Frank Kuechenmeister,Jens Paul,Michael Thiele

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)pp.68-73, (2017)

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Advanced chip package interaction qualification for critical stacks in combination with Cu pillar interconnect technology

Bjoern Boehme,Christian Goetze,Sebastian Dej, Po-Hsiang Wang,Frank Kuechenmeister,Dirk Breuer,Jens Paul,Michael Thiele

2016 6th Electronic System-Integration Technology Conference (ESTC)pp.1-6, (2016)

引用3浏览0EIWOS引用

Thermo-compression Bonding Assembly Process and Reliability Studies of Cu Pillar Bump on Cu/Low-K Chip

K. Y. Au,F. X. Che,Jie Li Aw,Jong-Kai Lin,Bjoern Boehme,Frank Kuechenmeister

Electronics Packaging Technology Conference（2014）

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Reliability of Embedding Concepts for Discrete Passive Components in Organic Circuit Boards

R. Schwerz,B. Boehme,M. Roellig,K. -J. Wolter,N. Meyendorf

2013 IEEE 63rd Electronic Components and Technology Conference（2013）

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Technology , Functionality and Reliability of Integrated Ultrasonic Microsystems for SHM in CFRP Airplane Structures

Mike ROELLIG,Frank SCHUBERT,Georg LAUTENSCHLAEGER,Bjoern BOEHME, Michael FRANKE, Stefan MÜNCH,Norbert MEYENDORF

semanticscholar（2012）

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