Yung-Cheng Lee

Yung-Cheng Lee (M'92) received the B.S.M.E. degree from the National Taiwan University, Taipei, Taiwan, R.O.C., in 1978, and the M.S. and Ph.D. degrees from the University of Minnesota, in 1982 and 1984, respectively. He is currently a Professor of mechanical engineering and the Acting Director of the National Science Foundation (NSF) Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, University of Colorado at Boulder. Prior to joining the University of Colorado at Boulder in 1989, he was a Member of Technical Staff with AT&T Bell Laboratories, Murray Hill, NJ. His research activities include low-cost prototyping and thermal management of multichip modules, three-dimensional (3-D) packaging, self-aligning soldering, fluxless or solderless flip-chip connections, opto-electronics packaging, process control using fuzzy-logic models, and MEMS design and packaging. He is an Associate Editor of the American Society of Mechanical Engineering (ASME) Journal of Electronic Packaging. Dr. Lee was the recipient of the 1990 Presidential Young Investigator presented by the NSF, 1990, the 1992 Outstanding Young Manufacturing Engineer Award presented by the Society of Manufacturing Engineers (SME), 1992, the 1991 Outstanding Paper Award presented at the IEEE Electronic Components and Technology Conference (ECTC), the 1993 Outstanding Paper Award of the ASME Journal of Electronic Packaging, 1993, the 1988 Poster Session Best Paper Award presented at the Government Microwave Applications Conference, and a 1983–1984 Ph.D. Dissertation Fellowship presented by the University of Minnesota.