基本信息
浏览量:0
职业迁徙
个人简介
Yang Li received the M.S. degree in material science and engineering from Washington State University, Pullman, WA, USA, in 2014. She is currently pursuing the Ph.D. degree in power electronics packaging with the Department of Electrical and Computer Engineering, Stony Brook University, Stony Brook, NY, USA.
Before returning to academia, she had been a Reliability Engineer and then a Supervisor of Package Development and Simulation Team, Monolithic Power Systems, Chengdu, China.
研究兴趣
论文共 6 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Yang Li, Mustafeez-ul-Hassan,Abdul Basit Mirza, Yang Xie,Shiyue Deng,Sama Salehi Vala,Fang Luo,Xuhui Feng,Sreekant Narumanchi,Jack David Flicker
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
IEEE transactions on industry applicationsno. 3 (2023): 2842-2855
2023 IEEE Energy Conversion Congress and Exposition (ECCE)pp.6510-6515, (2023)
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICSno. 5 (2023): 4918-4928
2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APECpp.331-335, (2023)
作者统计
#Papers: 6
#Citation: 4
H-Index: 1
G-Index: 2
Sociability: 3
Diversity: 0
Activity: 2
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn