基本信息
浏览量:3
职业迁徙
个人简介
Wei He received the B.S. degree in mechanical engineering from Jinggangshan University, Ji’an, China, in 2016, and the M.S. degree from the Guilin University of Electronic Science and Technology, Guilin, China, in 2019. He is currently pursuing the Ph.D. degree in engineering thermophysics with the Nanjing University of Science and Technology, Nanjing, China.
His research interests are thermal management research on 3-D IC, embedded microchannel research, and optimization.
研究兴趣
论文共 16 篇作者统计合作学者相似作者
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引用量
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期刊级别
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APPLIED THERMAL ENGINEERING (2024)
2024 25th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2024)
SSRN Electronic Journal (2022)
IEEE transactions on components, packaging, and manufacturing technologyno. 8 (2022): 1339-1349
semanticscholar(2021)
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APS Division of Fluid Dynamics Meeting Abstracts (2020)
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2016 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS) (2016)
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作者统计
#Papers: 16
#Citation: 31
H-Index: 2
G-Index: 5
Sociability: 4
Diversity: 1
Activity: 0
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