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2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)pp.1-4, (2023)
IEEE Transactions on Semiconductor Manufacturingno. 3 (2023): 327-331
G. W. Burr,H. Tsai, W. Simon,I. Boybat,S. Ambrogio, C.-E. Ho, Z.-W. Liou,M. Rasch,J. Büchel,P. Narayanan,T. Gordon, S. Jain,T. M. Levin,K. Hosokawa,M. Le Gallo, H. Smith, M. Ishii,Y. Kohda,A. Chen,C. Mackin, A. Fasoli, K. ElMaghraoui,R. Muralidhar,A. Okazaki, C. -T. Chen,M. M. Frank, C. Lammie,A. Vasilopoulos, A. M. Friz, J. Luquin,S. Teehan,I. Ahsan,A. Sebastian,V. Narayanan
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
Geoffrey W. Burr,Pritish Narayanan,Stefano Ambrogio,Atsuya Okazaki,Hsinyu Tsai,Kohji Hosokawa,Charles Mackin,Akiyo Nomura,Takeo Yasuda,J. Demarest,Kevin Brew,V. Chan,S. Choi,T. Gordon,T. M. Levin,Alexander M. Friz,Masatoshi Ishii,Yasuteru Kohda,An Chen,Andrea Fasoli,Jose Luquin,Nicole Saulnier,S. Teehan,Ishtiaq Ahsan,Vijay Narayanan
VLSI Technology and Circuitspp.1-2, (2023)
J. Demarest,N. Arnold,K. Brew,V. Chan, A. Cote,T. Gordon, M. Iwatake,G. Lian, J. Li,I. OK,S. McDermott,I. Saraf,N. Saulnier,L. Tierney, A. Varghese
International Symposium for Testing and Failure AnalysisISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis (2021)
作者统计
#Papers: 5
#Citation: 0
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Sociability: 4
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