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Research Interests

Papers共 215 篇Author StatisticsCo-AuthorSimilar Experts

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Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging (vol 35, 297, 2024)
Yuanming Chen, Junjie Huang,Yunzhong Huang, Qingyuan Li, Hong Zeng, Ling Tian, Jingsong Li,Shouxu Wang,Wei He,Yan Hong
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSno. 9 (2024)
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Fabrication and Characterization of Nano-Zno/cnts/pdms Flexible Pressure Sensor
Yuanming Chen,Jiaqi Li,Yan Hong,Wei He, Yao Tang,Guoyun Zhou,Zhenlin Xu,Yaozong He, Zhiguo Nie,Jiaqiang Zhang,Shouxu Wang
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSno. 21 (2023)
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Dual-anchor Anti-Corrosion Coating of Copper Foil for High-Speed Interconnects
Huijuan Shi,Guoyun Zhou,Qin Zhang,Pengju Wang,Yan Hong,Wei He,Shouxu Wang,Chong Wang,Zhiwei Han
Journal of industrial and engineering chemistry/Journal of Industrial and Engineering Chemistry - Korean Society of Industrial and Engineering Chemistry (2023): 371-381
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Progress and prospects of super-filling in Damascene copper electroplating process
Chong Wang, Yixiao Peng,Jiujuan Li,Guoyun Zhou,Yuanming Chen,Shouxu Wang, Wei He
SCIENTIA SINICA Chimicano. 10 (2023): 1880-1890
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Author Statistics

#Papers: 217

#Citation: 1711

H-Index: 23

G-Index: 33

Sociability: 6

Diversity: 1

Activity: 2

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