Shizun Hu

Shizun Hu (Student Member, IEEE) is currently pursuing the B.E. degree in electronic packaging technology from the Beijing Institute of Technology (BIT), Beijing, China. His current research interests include electronic packaging technologies and simulation of transient liquid phase bonding. Mr. Hu won the first prize in the “Century Cup” Creative Competition of Beijing Institute of Technology and the Outstanding Student of Beijing Institute of Technology, in 2021. In 2022, he won the first prize in the Beijing “Internet +” College Student Innovation and Entrepreneurship Competition and the Outstanding Student Scholarship.