基本信息
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职业迁徙
个人简介
Shi-Chang Tseng received the Ph.D. degree from the University of Wisconsin–Madison, Madison, in 1993. From 2010 to 2016, he was with the Dean of the College of Engineering, National Yunlin University of Science and Technology (YunTech), Taiwan.
Since 2017, he has been the Dean of the Office of International Affairs, YunTech. His recent research focuses on novel technology of micro injection molding. He has developed some creative methods to manufacture micro molds and micro hot runners by LIGA and/or micro machining processes. He has authored the fabrication of micro components, such as optical fiber connectors, optoelectronics devices, micro fiber spinnerets, and bio-chips by the micro injection molding technique. His current research interest includes polymer processing.
研究兴趣
论文共 35 篇作者统计合作学者相似作者
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2024 IEEE 7th Eurasian Conference on Educational Innovation (ECEI)pp.63-65, (2024)
Helmy Dewanto Bryantono,Melsiani Rosdiani Fillipin Saduk, Jialin Hong,Meng-Hsun Tsai,Shi‐Chang Tseng
Advances in science, technology and engineering systems journalno. 4 (2023): 11-17
2022 8th International Conference on Applied System Innovation (ICASI)pp.179-182, (2022)
2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA) (2022)
Chao-Tsai Huang, You-Ti Rao, Kuan-Yu Ko,Chih-Chung Hsu, You-Sheng Zhou,Chia-Hsiang Hsu, Rong-Yue Chang,Shi-Chang Tseng, Likey Chen
MICROMACHINESno. 11 (2021): 1335
2018 IEEE International Conference on Advanced Manufacturing (ICAM) (2018)
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作者统计
#Papers: 36
#Citation: 191
H-Index: 8
G-Index: 13
Sociability: 4
Diversity: 2
Activity: 5
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