基本信息
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职业迁徙
个人简介
Margie Li received the B.E. degree from the Department of materials engineering, Huazhong University of Science and Technology, Wuhan, China, and the Ph.D. degree from the City University of Hong Kong, Hong Kong, in 2009 and 2014, respectively.
She is currently a Process Development Engineer with ASM Technology Hong Kong, Hong Kong. Her current research interests include fan-out wafer-level packaging technology, flip-chip interconnect technology and micro-electronics failure analysis.
Dr. Li is also a certified SMT Engineer by SMTA.
研究兴趣
论文共 9 篇作者统计合作学者相似作者
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John H. Lau,Ming Li,Lei Yang,Margie Li,Iris Xu,Tony Chen,Sandy Chen,Qing Xiang Yong, Janardhanan Pillai Madhukumar,Wu Kai,Nelson Fan,Eric Kuah,Zhang Li,Kim Hwee Tan,Winsons Bao,Sze Pei Lim,Rozalia Beica,Cheng-Ta Ko,Cao Xi
IEEE transactions on components, packaging, and manufacturing technologyno. 6 (2018): 991-1002
International Symposium on Microelectronicsno. 1 (2017): 000747-000753
John H. Lau,Ming Li,Dewen Tian,Nelson Fan,Eric Kuah,Wu Kai,Margie Li, J. Hao, Yiu Ming Cheung,Zhang Li,Kim Hwee Tan,Rozalia Beica, Thomas Taylor,Cheng-Ta Ko,Henry Yang,Yu-Hua Chen,Sze Pei Lim,Ning Cheng Lee,Jiang Ran,Cao Xi,Koh Sau Wee, Qingxiang Yong
作者统计
#Papers: 9
#Citation: 310
H-Index: 8
G-Index: 8
Sociability: 4
Diversity: 2
Activity: 0
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