Po-Ching Wu received the B.S. degree from the Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, in 2018. He is currently pursuing the Ph.D. degree with the Institute of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan.
His research interests include backside grinding–backside metallization (BGBM) of Si wafer, power devices technology, and electronic package.