N. R. Basavanhally

Nagesh Basavanhally received the undergraduate degree from the National Institute of Engineering, University of Mysore, Mysore, India. He graduated (with honors) in mechanical engineering. He received the Ph.D. degree in solid mechanics from the University of Pittsburgh, Pittsburgh, PA. He is the Co-Editor of Optoelectronic Packaging (Wiley, 1997), and coauthor of two book chapters. He is the author of more than 40 papers and holds more than 30 patents. He has been working in the field of optoelectronic packaging and assembly for more than 20 years. He is a Distinguished Member of Technical Staff at Bell Laboratories, Lucent Technologies, Murray Hill, NJ. He is currently working in the field of MEMS hybrid integration and MEMS-based optical subsystem design. His applied research interests include hybrid integration, optomechanical design, packaging, and assembly-related activities in electronic and optical interconnection technologies. Dr. Basavanhally is a member of the ASME and a Licensed Professional Engineer in the State of Pennsylvania. He has been on the IEEE LEOS Subcommittee on Optoelectronic Packaging, Manufacturing and Reliability for the past 12 years.