基本信息
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个人简介
Mohan Kathaperumal (Member, IEEE) received the bachelor’s and master’s degrees from Madras Christian College in 1985 and 1987, respectively, and the Ph.D. degree in chemistry from the Indian Institute of Science, Bengaluru, India, in 1994.
He is currently a Senior Research Engineer with the 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA. Prior to joining Georgia Tech, he was working with the University of Arizona and Nitto Denko Technical Corporation.
研究兴趣
论文共 56 篇作者统计合作学者相似作者
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Mohanalingam Kathaperumal,Pragna Bhaskar, Austin J. Toro,Pratik Nimbalkar, Lila Dahal,Muhannad S. Bakir
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1958-1962, (2024)
Sai Saravanan Ambi Venkataramanan,Prahalad Murali,Dustin Allen Gilbert,Mohanalingam Kathaperumal,Mark D. Losego
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.2250-2255, (2024)
Pruek Vanna-Iampikul,Lingjun Zhu,Serhat Erdogan,Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold,Sung Kyu Lim
2023 60th ACM/IEEE Design Automation Conference (DAC)pp.1-6, (2023)
Macromolecular Rapid Communications (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.147-151, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1603-1608, (2023)
IEEE transactions on components, packaging, and manufacturing technologyno. 3 (2023): 291-299
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1744-1748, (2023)
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作者统计
#Papers: 56
#Citation: 1238
H-Index: 16
G-Index: 35
Sociability: 5
Diversity: 2
Activity: 19
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