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Research Interests
Electrical And Elect...Electrical And Electronic EngineeringComputer ScienceEngineeringGeneralMemristors202020162024
20172023

Papers共 33 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
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期刊级别
合作者
合作机构
All20242023202220202019201820172014
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Author Statistics
00.20.40.60.81#Papers#CitationH-IndexG-IndexSociabilityDiversityActivity

#Papers: 33

#Citation: 5139

H-Index: 19

G-Index: 27

Sociability: 5

Diversity: 2

Activity: 22

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  • 合作者
  • 学生
  • 导师
Zhongrui Wang (王中锐)合作论文数
School of Microelectronics, College of Engineering, Southern University of Science and Technology28
J. Joshua Yang合作论文数
Ming Hsieh Department of Electrical and Computer Engineering, Viterbi School of Engineering, University of Southern California26
Qiangfei Xia合作论文数
Department of Electrical and Computer Engineering, College of Engineering, University of Massachusetts Amherst;Nanodevices and Integrated Systems Laboratory, University of Massachusetts Amherst;TetraMem - Accelerate The World24
Rivu Midya合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA20
Wenhao Song合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA20
Can Li合作论文数
Department of Electrical and Electronic Engineering, Faculty of Engineering, The University of Hong Kong17
Peng Lin (林鹏)合作论文数
College of Materials Science and Engineering, Shenzhen university17
Hao Jiang (蒋昊)合作论文数
Frontier Institute of Chip and System, Fudan University17
Mark Barnell合作论文数
14
Qing Wu合作论文数
14
Yunning Li合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA13
Ye Zhuo合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA13
Navnidhi Upadhyay合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA11
Saumil Joshi合作论文数
Dept. of Electr., Comput., & Energy Eng., Univ. of Colorado;c;Dept. of Electr., Comput., & Energy Eng., Univ. of Colorado11
R. Stanley Williams合作论文数
Department of Electrical and Computer Engineering, College of Engineering, Texas A&M University11
Miao Hu合作论文数
TetraMem9
Shiva Asapu合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA8
Yan Peng (彭艳)合作论文数
School of Future Technology, Shanghai University;Institute of Artificial Intelligence, Shanghai University;Research Institute of USV Engineering, Shanghai University8
Ning Ge (葛宁)合作论文数
Department of Electronic Engineering, Tsinghua University8
Huaqiang Wu (吴华强)合作论文数
School of Integrated Circuits, Tsinghua University;Center of Nanofabrication, Tsinghua University7
John Paul Strachan合作论文数
Faculty of Electrical Engineering and Information Technology, RWTH Aachen University;Peter Grünberg Institute, Forschungszentrum Jülich7
Sergey Savel’Ev合作论文数
Department of Physics, Loughborough University6
Xumeng Zhang (张续猛)合作论文数
Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China5
Daniel Belkin合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA5
Jiaming Zhang合作论文数
Department of Geological Sciences, University of Michigan5
Jung Ho Yoon合作论文数
Department of Internal Medicine, Korea Cancer Center Hospital4
moon hyung jang合作论文数
3
Kate J. Norris合作论文数
3
Qinru Qiu合作论文数
Department of Electrical Engineering and Computer Science, College of Engineering& Computer Science, Syracuse University3
Huolin Xin合作论文数
Department of Physics Astronomy, University of California, Irvine3
Mingche Wu合作论文数
2
Wenbo Yin合作论文数
2
Xinke Shen合作论文数
Department of Biomedical Engineering, Tsinghua University;Tsinghua Laboratory of Brain and Intelligence, Tsinghua University;Tsinghua University, Tsinghua University2
Fatemeh Kiani合作论文数
Modeling Hlth Res Ctr, Shahrekord Univ Med Sci2
He Yuanyuan合作论文数
2
Rui Wang合作论文数
2
Yijun Li (李一峻)合作论文数
College of Chemistry, Nankai University2
Peng Zhou (周鹏)合作论文数
School of Microelectronics, Fudan University2
Xinyi Li合作论文数
2
Sen Song (宋森)合作论文数
Laboratory of Brain and Intelligence, Department of Biomedical Engineering, School of Medicine, Tsinghua University2
Jianshi Tang (唐建石)合作论文数
School of Integrated Circuits, Tsinghua University2
Qingqing Sun (孙清清)合作论文数
School of Microelectronics, Fudan University2
He Qian (钱鹤)合作论文数
School of Integrated Circuits, Tsinghua University2
Guoqiang Bi (毕国强)合作论文数
School of Data Science, University of Science and Technology of China;School of Life Sciences, University of Science and Technology of China2
Zhiyong Li (李志勇)合作论文数
2
Lin Chen (陈琳)合作论文数
School of Microelectronics, Fudan University2
Bin Gao (高滨)合作论文数
School of Integrated Circuits, Tsinghua University2
Zhang David合作论文数
1
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