Research Interests
Author Statistics
#Papers: 33
#Citation: 5139
H-Index: 19
G-Index: 27
Sociability: 5
Diversity: 2
Activity: 22
- 合作者
- 学生
- 导师

Zhongrui Wang (王中锐)合作论文数
School of Microelectronics, College of Engineering, Southern University of Science and Technology28

J. Joshua Yang合作论文数
Ming Hsieh Department of Electrical and Computer Engineering, Viterbi School of Engineering, University of Southern California26

Qiangfei Xia合作论文数
Department of Electrical and Computer Engineering, College of Engineering, University of Massachusetts Amherst;Nanodevices and Integrated Systems Laboratory, University of Massachusetts Amherst;TetraMem - Accelerate The World24

Rivu Midya合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA20

Wenhao Song合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA20

Can Li合作论文数
Department of Electrical and Electronic Engineering, Faculty of Engineering, The University of Hong Kong17

Peng Lin (林鹏)合作论文数
College of Materials Science and Engineering, Shenzhen university17

Hao Jiang (蒋昊)合作论文数
Frontier Institute of Chip and System, Fudan University17

Mark Barnell合作论文数
14

Qing Wu合作论文数
14

Yunning Li合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA13

Ye Zhuo合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA13

Navnidhi Upadhyay合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA11

Saumil Joshi合作论文数
Dept. of Electr., Comput., & Energy Eng., Univ. of Colorado;c;Dept. of Electr., Comput., & Energy Eng., Univ. of Colorado11

R. Stanley Williams合作论文数
Department of Electrical and Computer Engineering, College of Engineering, Texas A&M University11

Miao Hu合作论文数
TetraMem9

Shiva Asapu合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA8

Yan Peng (彭艳)合作论文数
School of Future Technology, Shanghai University;Institute of Artificial Intelligence, Shanghai University;Research Institute of USV Engineering, Shanghai University8

Ning Ge (葛宁)合作论文数
Department of Electronic Engineering, Tsinghua University8

Huaqiang Wu (吴华强)合作论文数
School of Integrated Circuits, Tsinghua University;Center of Nanofabrication, Tsinghua University7

John Paul Strachan合作论文数
Faculty of Electrical Engineering and Information Technology, RWTH Aachen University;Peter Grünberg Institute, Forschungszentrum Jülich7

Sergey Savel’Ev合作论文数
Department of Physics, Loughborough University6

Xumeng Zhang (张续猛)合作论文数
Chinese Acad Sci, Inst Microelect, Key Lab Microelect Devices & Integrated Technol, Beijing 100029, Peoples R China5

Daniel Belkin合作论文数
Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA5

Jiaming Zhang合作论文数
Department of Geological Sciences, University of Michigan5

Jung Ho Yoon合作论文数
Department of Internal Medicine, Korea Cancer Center Hospital4

moon hyung jang合作论文数
3

Kate J. Norris合作论文数
3

Qinru Qiu合作论文数
Department of Electrical Engineering and Computer Science, College of Engineering& Computer Science, Syracuse University3

Huolin Xin合作论文数
Department of Physics Astronomy, University of California, Irvine3

Mingche Wu合作论文数
2

Wenbo Yin合作论文数
2

Xinke Shen合作论文数
Department of Biomedical Engineering, Tsinghua University;Tsinghua Laboratory of Brain and Intelligence, Tsinghua University;Tsinghua University, Tsinghua University2

Fatemeh Kiani合作论文数
Modeling Hlth Res Ctr, Shahrekord Univ Med Sci2

He Yuanyuan合作论文数
2

Rui Wang合作论文数
2

Yijun Li (李一峻)合作论文数
College of Chemistry, Nankai University2

Peng Zhou (周鹏)合作论文数
School of Microelectronics, Fudan University2

Xinyi Li合作论文数
2

Sen Song (宋森)合作论文数
Laboratory of Brain and Intelligence, Department of Biomedical Engineering, School of Medicine, Tsinghua University2

Jianshi Tang (唐建石)合作论文数
School of Integrated Circuits, Tsinghua University2

Qingqing Sun (孙清清)合作论文数
School of Microelectronics, Fudan University2

He Qian (钱鹤)合作论文数
School of Integrated Circuits, Tsinghua University2

Guoqiang Bi (毕国强)合作论文数
School of Data Science, University of Science and Technology of China;School of Life Sciences, University of Science and Technology of China2

Zhiyong Li (李志勇)合作论文数
2

Lin Chen (陈琳)合作论文数
School of Microelectronics, Fudan University2

Bin Gao (高滨)合作论文数
School of Integrated Circuits, Tsinghua University2

Zhang David合作论文数
1
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