Mario Baum

Mario Baum was born in Burgstaedt, Germany, in 1975. He received the combined M.B.E. degree from the Chemnitz University of Technology. In 2015, he finished the Ph.D. thesis on micro patterning and 3-D packaging technologies. He started working as an Application Engineer for GEMAC mbH Chemnitz, where he was involved in micromechanical sensor systems. In 2002, he joined the Prof. Gessner Team, Fraunhofer ENAS, as a Scientist with research and marketing tasks. His research work is focused on MEMS packaging, and wafer bonding and medical applications.