Haiqi Lai

Haiqi Lai received the bachelor’s degree in mechanical design, manufacturing, and automation from the Sun Yat-sen College of the University of Electronic Science and Technology in 2015. He is currently pursuing the master’s degree with the Guangdong University of Technology, Guangzhou, China. His current research interests are microelectronic packaging and interconnection technology, preparation, and sintering of micronano multisize copper paste.