基本信息
浏览量:257
职业迁徙
个人简介
His current research interests include electronic and thermal materials for microelectronics packaging and energy storage systems
研究兴趣
论文共 186 篇作者统计合作学者相似作者
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期刊级别
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Materials Today (2023): 399-423
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2247-2254, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1609-1613, (2023)
IEEE transactions on components, packaging, and manufacturing technologyno. 2 (2023): 219-229
Xingchen Li,Xiaofan Jia,Kyoung-sik Moon,Joon Woo Kim,Aadit Pandey, Anthony Chiu, Andrew Kenerson,Madhavan Swaminathan
2023 IEEE Radio and Wireless Symposium (RWS)pp.129-131, (2023)
IEEE Transactions on Terahertz Science and Technologyno. 3 (2023): 270-279
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1342-1348, (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.1282-1286, (2022)
2022 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS 2022)pp.687-690, (2022)
MRS Advancesno. 29 (2022): 630-634
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作者统计
#Papers: 186
#Citation: 7038
H-Index: 39
G-Index: 80
Sociability: 6
Diversity: 3
Activity: 63
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