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论文共 19 篇作者统计合作学者相似作者

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Insights on Inter-metal Reliability Assessment of High Voltage Interconnects
Kwang Sing Yew, Ran Xing Ong,Hin Kiong Yap,Wanbing Yi, Jacquelyn Phang, R. Chockalingam, Juan Boon Tan
2022 IEEE International Reliability Physics Symposium (IRPS) (2022)
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A Perspective of MIM Defect Density Performance Improvement for Automotive Chip Fabrication
Ee Jan Khor,Jian Xun Sun, Zin Tun Thant,Ramasamy Chockalingam, Wei-Hui Hsu, Pannirselvam Somasuntharam,Kwang Sing Yew,Hin Kiong Yap, Juan Boon Tan
2022 33RD ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) (2022)
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Interconnects Variability Control for High Voltage Applications
Kwang Sing Yew,Yi Jiang,Wanbing Yi,Ramasamy Chockalingam, Ran Xing Ong, Bo Li, Juan Boon Tan
2021 IEEE International Interconnect Technology Conference (IITC) (2021)
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Optimizing Interconnects RC Variability for Automotive Manufacturing Using Novel Advanced Process Control
Kwang Sing Yew, Ee Jan Khor, Choon Gay Lee,Ramasamy Chockalingam,Juan Boon Tan
International Interconnect Technology Conferencepp.43-45, (2020)
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Analysis of Extreme Pattern Density and Interconnects Routing Impacts on Via Open
Yi Jiang,Kwang Sing Yew,Kemao Lin, Weining Cheng, Curtis Hsieh,Jonathan Ong,Wanbing Yi,Ramasamy Chockalingam, Soh Yun Siah,Juan Boon Tan
2020 IEEE International Interconnect Technology Conference (IITC)pp.61-63, (2020)
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Interconnects Electrical Parametric Variability Control for Automotive Manufacturing
Kwang Sing Yew,Ramasamy Chockalingam, Choon Gay Lee, Jasper Goh, Baozhuo Chen,Xiaochong Guan, Rex Hsu,Juan Boon Tan
2019 Electron Devices Technology and Manufacturing Conference (EDTM) (2019)
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作者统计

#Papers: 19

#Citation: 104

H-Index: 6

G-Index: 7

Sociability: 4

Diversity: 2

Activity: 7

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