Kuo-Chin Chang

Kuo-Chin Chang received the B.S. degree in engineering science from National Cheng Kung University, Taiwan, R.O.C., in 1993 and the Ph.D. degree in power mechanical engineering from National Tsing Hua University, Hsinchu, Taiwan, in 2003. He was a Lecturer of power mechanical engineering at National Tsing Hua University, in 1999. He joined the Packaging Core Competence Department, Taiwan Semiconductor Manufacturing Company, Hsinchu, in 2003, and he is the Principal Engineer responsible for FEM modeling and design of flip chip package. His research interests include electronic package design and analysis, reliability analysis, and the semiconductor fabrication process.