基本信息
浏览量:2
职业迁徙
个人简介
Kevin Chai Tshun Chuan (Senior Member, IEEE) received the B.Eng. (Hons.) and Ph.D. degrees in electronic and electrical engineering from the University of Glasgow, U.K., in 2002 and 2007, respectively, developing tissue cell imaging solution based on Electrical-Impedance-Tomography on a CMOS chip.
He joined the Institute of Microelectronics, A*STAR, Singapore, in 2008, as a Research Scientist and developed a silicon-nanowire based biosensor readout system for the detection of biomarkers in cardiac disease. He received several competitive A*STAR grants as a PI/Co-PI for MEMS sensor-related applications in temperature, motion and sound detection, cell counting, electronic stethoscope system for the early detection of diastolic dysfunction in hypertensive heart disease, and so on. He currently heads a department of more than 30 IC designers working on various topics from AI powered hardware accelerators looking at both deep learning and neuromorphic methodologies, compute-in-memory using emerging memories, hardware security for edge IOT, power management solution with IVR, mmWave IC, and design acceleration techniques using machine learning.
研究兴趣
论文共 49 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERSno. 8 (2024): 3672-3682
Dan Lei Yan,Chan Kuen Sim, Hussain Ansari Md Arif,Nur Aisyah Binte Kuyob,M. Kumarasamy Raja,Kevin Tshun Chuan Chai
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFSno. 10 (2023): 3847-3851
2023 IEEE International Ultrasonics Symposium (IUS)pp.1-4, (2023)
2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)pp.1837-1839, (2023)
引用0浏览0EIWOS引用
0
0
2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS)pp.1-5, (2023)
Y. S. Wang,K. T. C. Chai, D. S. H. Chen, E. L. C. Wai, J. Sharma, B. V. Phuong,Ching Eng Png,Amit Lal
2023 8th International Conference on Frontiers of Signal Processing (ICFSP) (2023)
2023 IEEE International Ultrasonics Symposium (IUS)pp.1-4, (2023)
IEEE Journal of Solid-State Circuitsno. 8 (2023): 2372-2382
2023 IEEE 23RD INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY, NANOpp.1042-1047, (2023)
A. Mani, C. Y. Sheng, D. Zhu, R. M. Veetil, M. Parikshit,T. W. W. Mass, C. S. Choong, X. Xuewu, R. P. Dominguez,A. I. Kuznetsov, P. Krishna, P. Keyi,K. T. C. Chai,A. T. Do
2023 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, ISCAS (2023)
加载更多
作者统计
#Papers: 47
#Citation: 467
H-Index: 12
G-Index: 21
Sociability: 5
Diversity: 2
Activity: 8
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn