基本信息
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职业迁徙
个人简介
Jun-Bae Kim received the B.S., M.S., and Ph.D. degrees in electronic engineering from Hanyang University, Seoul, South Korea, in 1993, 1995, and 2001, respectively.
In 2004, he joined Samsung Electronics, Hwaseong, South Korea, where he has been involved in the design of high speed DRAM interface circuits such as DLL, IO circuits. Since 2018, he has been responsible for IC-level EMC at DRAM. His current research interests include IC-level EMC, signal/power integrity, and IO circuits.
研究兴趣
论文共 11 篇作者统计合作学者相似作者
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Jun-Bae Kim, Taeho Kim,Chang Soo Yoon,Janghoo Kim, Byungjin Kwon,Youngbong Han,Jungho Jin,Seungbae Lee,Yoo-Chang Sung,Seung-Jun Bae,Daihyun Lim,Tae-Young Oh
2024 IEEE 28TH WORKSHOP ON SIGNAL AND POWER INTEGRITY, SPI 2024 (2024)
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 1 (2024): 281-292
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.311-314, (2023)
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (2022)
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (2022)
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium (2021)
2015 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC) (2015)
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mag(2012)
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作者统计
#Papers: 11
#Citation: 74
H-Index: 4
G-Index: 7
Sociability: 4
Diversity: 1
Activity: 0
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