Julien Bertheau - IMEC | 人才画像

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论文共 12 篇作者统计合作学者相似作者

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Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer

Ji-Youn Kwak,Emmanuel Chery,Julien Bertheau,John Slabbekoorn,Joke De Messemaeker,Eric Beyne

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1080-1084, (2023)

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A Study on IMC Morphology and Integration Flow for Low Temperature and High Throughput TCB Down to $10\mu \mathrm{m}$ Pitch Microbumps

Jaber Derakhshandeh,Carine Gerets, Fumihiro Inoue,Giovanni Capuz, Vladimir Cherman,Melina Lofrano, Lin Hou,Tom Cochet,Inge De Preter,Tomas Webers,Pieter Bex,Geraldine Jamieson,Masataka Maehara,Ehsan Shafahian,Julien Bertheau,Eric Beyne,Douglas Charles La Tulipe,Gerald Beyer,Geert Van der Plas,Andy Miller

Electronic Components and Technology Conferencepp.1119-1124, (2021)

引用1浏览0EIWOS引用

Development of Compression Molding Process for Fan-Out Wafer Level Packaging

Bertheau Julien,Duval F. C. Fabrice, Kubota Tadashi,Bex Pieter,Kennes Koen,Phommahaxay Alain,Podpod Arnita,Beyne Eric,Miller Andy,Beyer Gerald

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)（2020）

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10 and 7 m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Jaber Derakhshandeh,Giovanni Capuz,Vladimir Cherman,Fumihiro Inoue,Inge De Preter,Lin Hou,Pieter Bex,Carine Gerets,Fabrice Duval,Tomas Webers,Julien Bertheau,Stefaan Van Huylenbroeck,Alain Phommahaxay,Ehsan Shafahian,Geert Van der Plas,Eric Beyne,Andy Miller,Gerald Beyer

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)pp.617-622, (2020)

引用9浏览0EIWOS引用

Protective Layer for Collective Die to Wafer Hybrid Bonding

Fumihiro Inoue,Julien Bertheau,Samuel Suhard,Alain Phommahaxay, Takuya Ohashi, Tetsuro Kinoshita,Yohei Kinoshita,Eric Beyne

2019 International 3D Systems Integration Conference (3DIC)（2019）

引用9浏览0EIWOS引用

Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up

Arnita Podpod,Alain Phommahaxay,Pieter Bex,John Slabbekoorn,Julien Bertheau,Abdellah Salahouelhadj,Erik Sleeckx,Andy Miller,Gerald Beyer,Eric Beyne,Alice Guerrero,Kim Yess,Kim Arnold

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)（2019）

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3DIC 2019 Authors Index

Imed Jani,Didier Lattard, Sarah Kim,Han Kyeol Seo,Hae-Sung Park, Koji Sakui,Takayuki Ohba,Demin Liu,Po-Chih Chen,Yi-Chieh Tsai,Kuan-Neng Chen,Jing Tao, Hong Yu Li, Peng Zhao, Yu Dian Lim,Anak Agung Alit Apriyana,Chuan Seng Tan,Fumihiro Inoue,Julien Bertheau,Masahide Goto,Yuki Honda,Toshihisa Watabe,Kei Hagiwara,Masakazu Nanba,Yoshinori Iguchi,Takuya Saraya,Masaharu Kobayashi,Eiji Higurashi

2019 International 3D Systems Integration Conference (3DIC) (2019)

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Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift

Arnita Podpod,Alain Phommahaxay,Pieter Bex,Koen Kennes,Julien Bertheau, Hariharan Arumugam,Tom Cochet,Kenneth Rebibis, Erick Sleeckx,Andy Miller,Gerald Beyer,Eric Beyne,Alice Guerrero,Xiao Liu,Qi Wu,Kim Yess,Kim Arnold

2019 International Wafer Level Packaging Conference (IWLPC)pp.1-6, (2019)

引用4浏览0EIWOS引用

Extreme Thinned-Wafer Bonding Using Low Temperature Curable Polyimide for Advanced Wafer Level Integrations

Julien Bertheau,Fumihiro Inoue,Alain Phommahaxay,Lan Peng,Serena Iacovo,Nouredine Rassoul,Erik Sleeckx, Kenneth Rebibs,Andy Miller,Gerald Beyer,Eric Beyne,Atsushi Nakamura

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)（2018）

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A Unique Temporary Bond Solution Based on a Polymeric Material Tacky at Room Temperature and Highly Thermally Resistant Application Extension from 3D-SIC to FO-WLP

Alain Phommahaxay,Goedele Potoms,Julien Bertheau,Pieter Bex,Fabrice Duval,Arnita Podpod,Teng Wang,Greet Verbinnen,Gerald Beyer,Erik Sleeckx,Eric Beyne,Atsushi Nakamura,Yoshitaka Kamochi

Electronic Components and Technology Conference（2017）

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