John M. Wilson (Senior Member, IEEE) received the B.S., M.S., and Ph.D. degrees in electrical engineering from North Carolina State University (NCSU), Raleigh, NC, USA. From 2015 to 2017, he led a team in the design of a 25-Gb/s single-ended ground-referenced signaling link, in 16-nm FinFET CMOS, enabling tera-byte per-second communication for multi-chip module (MCM) and printed circuit board (PCB) channels at 1.17 pJ/bit. His research interests include high-speed I/O circuit design, on-chip signaling, signal integrity, advanced packaging, and chip/package co-design. From 2003 to 2006, he was a Research Professor at NCSU leading projects in advanced packaging, low-power capacitive and inductive coupled transceivers for 3-D integrated circuits (ICs), and circuits for on-chip global signaling. From 2006 to 2012, while with Rambus, Inc., Chapel Hill, NC, USA, he worked on high-speed I/O circuit design and methods to mitigate signal and power integrity problems in memory interfaces. He is currently a Principal Research Scientist at the Circuits Research Group, NVIDIA Durham, NC, USA. He has more than 72 publications and 47 granted patents. His work focuses on pathfinding for high-bandwidth density data-movement solutions and the transfer of developed technology from research to production.