Jinlin Liu

Jinlin Liu (Member, IEEE) received the B.Sc. degree in communications engineering from the University of Electronic Science and Technology of China, Chengdu, China, in 2005, the Vordiploma degree from the Munich University of Technology, Munich, Germany, in 2011, and the Swedish Licentiate and Ph.D. degrees from the Chalmers University of Technology, Gothenburg, Sweden, in 2016 and 2019, respectively. From 2005 to 2007, he was a Test Engineer with Intel, Chengdu, China. From 2013 to 2014, he was a PCB Test Engineer with Eurodesign GmbH, Munich. He is currently working as a Research Fellow with the State Key Laboratory of Millimeter Waves, Southeast University, Nanjing, China. His current research interests include fundamental electromagnetic theory, millimeter-wave planar antennas in general, gap waveguide technology, and frequency-selective surfaces. Dr. Liu received the Best Student Paper Award First Place at the 2017 International Symposium on Antennas and Propagation. He also serves on the reviewer boards of several journals, including the IEEE Transactions on Antennas and Propagation, the IEEE Transactions on Microwave Theory and Techniques, the IEEE Transactions on Components, Packaging, and Manufacturing, the IEEE Antennas and Wireless Propagation Letters, the IEEE Microwave and Wireless Components Letters, and the Journal of Electromagnetic Waves and Applications.