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个人简介
Jae Wung Lee received the Ph.D. degree in material science and engineering from Seoul National University, Seoul, South Korea, in 2008. He joined the Institute of Microelectronics, A*STAR, in 2011, after receiving the post-doctoral degree with Tohoku University, Japan. His research interest is the design and fabrication of nano/microelectromechanical system (N/MEMS) with functional materials, such as piezoelectric materials, ferroelectric materials, magnetic materials, and metallic glass for better performance, and MEMS wafer level packaging using thin film encapsulation technique and wafer bonding technique for reliable and long life time of N/MEMS device.
研究兴趣
论文共 39 篇作者统计合作学者相似作者
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.76-80, (2022)
user-5f1f7d444c775e3a796188dc(2021)
Components, Packaging and Manufacturing Technology, IEEE Transactionsno. 99 (2015): 1-937
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作者统计
#Papers: 39
#Citation: 463
H-Index: 13
G-Index: 21
Sociability: 4
Diversity: 1
Activity: 0
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