基本信息
浏览量:0
职业迁徙
个人简介
Hyunsu Chae received the B.S. and M.S. degrees in electrical engineering from Kwangwoon University, Seoul, South Korea, in 1997 and 1999, respectively.
In 1999, he joined Samsung Advanced Institute of Technology (SAIT), Suwon, South Korea, where he was involved in developing transceiver modules for passive optical networking (PON). In 2008, he joined the System LSI Business, Samsung Electronics, Hwaseong, South Korea, where he has been developing high-speed interface IPs, such as USB, DisplayPort, PCIe, and MIPI. His current research interests include die-to-die interface for the HPC application and SerDes IPs for automotive.
研究兴趣
论文共 3 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Jahoon Jin,Soo-Min Lee,Kyunghwan Min,Sodam Ju,Jihoon Lim, Jisu Yook, Jihoon Lee,Hyunsu Chae,Kwonwoo Kang,Yunji Hong,Yeongcheol Jeong, Sung-Sik Park,
IEEE JOURNAL OF SOLID-STATE CIRCUITSno. 1 (2024): 184-195
Soo-Min Lee,Jihoon Lim,Jaehyuk Jang, Hyoungjoong Kim,Kyunghwan Min, Woongki Min, Hyeonji Han, Gyusik Kim, Jaeyoung Kim,Chulho Kim,Sejun Jeon,Jinhoon Park,
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn