基本信息
浏览量:1
职业迁徙
个人简介
Hongduo Liu received the B.E. degree from the School of Information and Communication Engineering, University of Electronic Science and Technology of China, Chengdu, China, in 2020. He is currently working toward the Ph.D. degree with the Department of Computer Science and Engineering, The Chinese University of Hong Kong, Hong Kong. His research focuses on EDA and Hardware/Software Co-design.
研究兴趣
论文共 6 篇作者统计合作学者相似作者
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期刊级别
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合作机构
Hongduo Liu, Yijian Qian, Youqiang Liang, Bin Zhang, Zhaohan Liu, Tao He,Wenqian Zhao,Jiangbo Lu,Bei Yu
ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMSno. 3 (2024)
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systemspp.1-1, (2024)
2024 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, DATE (2024)
IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMSno. 5 (2023): 952-967
2023 60th ACM/IEEE Design Automation Conference (DAC)pp.1-6, (2023)
作者统计
#Papers: 6
#Citation: 52
H-Index: 2
G-Index: 2
Sociability: 3
Diversity: 0
Activity: 6
合作学者
合作机构
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