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个人简介
Hideki Shibata received the B.S. degree in metallurgical engineering and the Ph.D. degree in electrical and computer engineering from Nagoya Institute of Technology, Nagoya, Japan, in 1982 and 1995, respectively.
In 1982, he joined the Semiconductor Device Engineering Laboratory, Toshiba Corporation, Kawasaki, Japan. Since 1995, he has been engaged in the development of advanced copper/low-$k$ interconnect integration technology for high-performance logic and memory devices. Since 2001, as a member of the technical working group of International Technology Roadmap, he has contributed to formulation of the Cu/Low-$k$ roadmap. He is currently the Senior Manager of the Advanced Back-End-of-Line Technology Department, Center for Semiconductor Research and Development, Toshiba Corporation.
Dr. Shibata is a member of the Japan Society of Applied Physics. He was the recipient of the Best Paper Award from the IEEE International Interconnect Technology Conference (IITC) committee in 2006.
研究兴趣
论文共 108 篇作者统计合作学者相似作者
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International journal of molecular sciencesno. 12 (2024): 6520-6520
biorxiv(2024)
Journal of virologyno. 6 (2022)
2020 33RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2020)pp.785-790, (2020)
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作者统计
#Papers: 108
#Citation: 2270
H-Index: 27
G-Index: 44
Sociability: 6
Diversity: 3
Activity: 17
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