Harsono Simka - Samsung Electronics, San Francisco, USA

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论文共 17 篇作者统计合作学者相似作者

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Expanding Design Technology Co-Optimization Potentials with Back-Side Interconnect Innovation

Byung-Sung Kim, Subin Choi, Jung Han Lee, Kwangmuk Lee, Jisoo Park, Jiwook Kwon, Saehan Park, Kwanyoung Chun,Harsono Simka, Aravindh Kumar,Muhammed Ahosan Ul Karim,Ken Rim,Jaihyuk Song

Symposium on VLSI Technologypp.1-2, (2024)

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High-speed Emerging Memories for AI Hardware Accelerators

Anni Lu,Junmo Lee,Tae-Hyeon Kim,Muhammed Ahosan Ul Karim, Rebecca Sejung Park,Harsono Simka,Shimeng Yu

Nature Reviews Electrical Engineeringno. 1 (2024): 24-34

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Inverse Hybrid Bonding with Metal Oxide Framework As Infill for Heterogeneous Integration

Rohan Sahay, Dipayan Pal, Ashita Victor,Cheng-Hsuan Kuo,Madison Manley,Harsono Simka, Andy Kummel,Muhannad Bakir

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1837-1840, (2024)

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Electron-enhanced SiO₂ atomic layer deposition at 35 C using disilane and ozone or water as reactants

Jonas C. Gertsch,Zachary C. Sobell,Andrew S. Cavanagh,Harsono Simka,Steven M. George

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY Ano. 4 (2023)

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Role of Dose Optimization in Ru Atomic Layer Deposition for Low Resistivity Films

Victor Wang,Michael Breeden,Nickolas Ashburn,Matthew Bergschneider,Jacob Spiegelman,Harsono Simka,Kyeongjae Cho,Andrew C. Kummel

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY Bno. 1 (2023)

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Reverse Templating Effects of Low-Resistivity Ru ALD on Sputtered Ru

Victor Wang,Chenghsuan Kuo,Ravindra Kanjolia,Mansour Moinpour,Jacob Woodruff,Harsono Simka,Andrew C. Kummel

2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)pp.1-3, (2023)

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Ru ALD with Bulk-Like Resistivity for Interconnects